ProfTek supplies the complete high density computing infrastructure range for AI training, high-performance computing (HPC), and hyperscale data centre cooling. As GPU and accelerator power density continues to climb past 1000W per node, traditional air cooling cannot remove the heat. Direct liquid cooling and immersion cooling become engineering necessities — not options — for Australian and New Zealand operators of AI clusters, render farms, and scientific compute.
An NVIDIA H100 GPU dissipates up to 700 W in a single accelerator. A modern AI training rack with 8 H100 modules per node and 4-8 nodes per rack produces 20–45 kW of heat. Air cooling at that density requires hot-aisle/cold-aisle airflow rates that are mechanically and acoustically untenable. Direct-to-chip liquid cooling can remove 70–90% of the heat directly from CPUs and GPUs, with the remainder handled by reduced air-side cooling. For colocation operators and enterprise data centres planning AI workloads in Australia, the question is not whether to deploy liquid cooling, but when. ProfTek can specify CDU and FDU sizing matched to your rack density, target inlet temperature, and ambient climate — including integration with existing chilled water plant or new dry-cooler heat rejection.
41/51 Wentworth Ave, Pagewood,
NSW 2035
sales@prof-tek.com
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