XAVIS XSCAN-9800T PCB X-ray inspection system

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XAVIS XSCAN-9800T, 9800T25 and 9800P3 PCB X-ray Inspection

Compare XAVIS XSCAN-9800T and 9800T25 inline X-ray inspection options for PCB production. Start with the inspection task, board format and handling workflow when choosing between the published 2D and 3D configurations.

XSCAN-9800T and 9800T25 comparison

Selection factor XSCAN-9800T XSCAN-9800T25
Inspection approach Inline 2D X-ray Inline 3D AXI; overlap-removal technology
Board dimensions 150 × 50 mm minimum; 400 × 350 mm maximum Confirm the selected configuration
Maximum board weight 5 kg Confirm with XAVIS
Handling options Confirm line interfaces Optional review PC, loader, unloader and NG buffering

Plan the production-line installation

The 9800T listing gives a machine envelope of 1,000 mm wide × 1,370 mm deep × 1,700 mm high. Its stated services are single-phase AC 220 V, 20 A, 50/60 Hz and clean dry air at 150 L/min, 0.5–0.7 MPa. Confirm the installation drawing and site requirements for the quoted system.

The T25 listing describes automatic axis correction and a manufacturer inspection time of 1.5 seconds per point. This is not a complete-board throughput guarantee; inspection coverage, handling and programming affect the production cycle.

Assess your PCB inspection task

For Australian electronics production, provide representative assemblies and identify the joints or internal features that must be assessed. Discuss overlapping components, board thickness, fixtures, inspection coverage and how results will be reviewed.

  • Supply the smallest and largest board formats and expected product mix.
  • Define required inspection views, acceptance criteria and review workflow.
  • Confirm line transfer, reject handling, traceability and reporting interfaces.

Request a sample evaluation and current configuration specifications before selection.

XSCAN-9800P3 inline 3D configuration

The XSCAN-9800P3 adds an inline 3D X-ray PCB inspection configuration to the family. Supplier information lists multi-board and overlap inspection, together with auto-teaching. These details relate to the P3 and should not be applied automatically to the 9800T or 9800T25.

PCB size range 50 × 50 to 610 × 610 mm
Sample weight Less than 10 kg
X-ray voltage 40–150 kV
Detector CMOS flat-panel detector, 2340 × 2882 pixels
Detector pixel size 49.8 µm

Discussing a P3 application

Provide board dimensions, sample weight, target components and intended inspection workflow. Confirm cycle time for the required coverage and inspection programme rather than relying on a single headline CT speed.

See official XSCAN-9800P3 information and the XAVIS equipment range. Compare each configuration separately when reviewing a production requirement.


Contact ProfTek today to learn more about this product and how it can support your application.

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