XSCAN-9860AT semiconductor X-ray inspection equipment shown by XAVIS

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XAVIS XSCAN-9860 Semiconductor X-ray Inspection

The XAVIS XSCAN-9860AT series is a semiconductor X-ray inspection platform. Its manufacturer describes an automated hybrid 2D/3D inspection approach, with software and table configuration adapted to the application.

XSCAN-9860AT inspection configuration

The published series overview lists 2D/3D hybrid inspection and OCT technology. Ask ProfTek to confirm the imaging mode, sample handling and analysis functions included in the proposed system. The series name alone does not establish a particular resolution, scan time or sample capacity.

  • Application: semiconductor inspection.
  • Inspection approach: automated hybrid 2D/3D platform.
  • Configuration: application-specific software and table-size options are listed.

Define the sample and inspection task

For Australian electronics and semiconductor teams, prepare representative samples and identify the internal structures or interfaces that need assessment. Share package dimensions, material composition, fixtures and the inspection decision you need to make.

Discuss whether the task is process development, failure investigation or repeated production inspection. Agree on the required views, reporting format and method for reviewing results before selecting a configuration.

Confirm before specifying equipment

  • Sample envelope, weight and positioning requirements.
  • X-ray source, detector and achievable image quality for the actual sample.
  • Scan and handling time for the requested inspection coverage.
  • Automation, data export and integration requirements.
  • Installation drawing, utilities and operating requirements.

Request current model documentation and a sample evaluation. For the 9860AT, confirm resolution, throughput, tube settings and dimensional limits against the current configuration-specific specification.

XSCAN-9860A configuration

The supplier separately identifies the XSCAN-9860A. Its table lists a 100 kV source, 0.2 mA current and 4 W maximum target power. Published handling information includes a 300 × 300 mm inspection area, nine axes and 60° detector tilt.

The specification sheet separates 2D and 3D detector columns. Confirm the intended detector and imaging configuration when discussing the system. The A and AT labels should not be treated as interchangeable.

Base 9860 and existing 9860AT information

Base 9860 and 9860AT references share a legacy supplier sheet. Keep 9860AT information labelled to that model and confirm the current configuration before transferring specifications to a base 9860 or 9860A enquiry.

Application review

Provide the component dimensions, inspection target and required viewing or imaging mode. Request a configuration-specific specification and sample assessment criteria rather than assuming a common system-resolution figure across the family.

See official XSCAN-9860A information and the XAVIS equipment range.

When preparing an XSCAN-9860AT enquiry, distinguish an internal-feature review from a dimensional measurement. State whether results will be reviewed by an operator or passed to another analysis workflow. Include acceptable sample preparation, fixture restrictions and how often product types change. These details help define a representative evaluation and the configuration information that needs confirmation.


Contact ProfTek today to learn more about this product and how it can support your application.

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