Industrial materials · Australia & New Zealand
YINCAE materials for thermal interface assembly, including thin-bond-line thermal adhesives, diamond-filled interface adhesives and solderable conductive adhesive. Compare bond-line, dispensing and printing requirements with ProfTek.
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Current thermal interface materials range
Technical data and application guidance are available on each material page. Contact ProfTek if you need help comparing options.
About YINCAE TM 150E2 YINCAE TM 150E2 is a solderable conductive adhesive for thermal interface assembly for dispensing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Dispensing Specifications Application method Dispensing Viscosity 50-100 Kcp Process and […]
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About YINCAE TM 158 YINCAE TM 158 is a diamond-filled thermal interface adhesive for dispensing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Dispensing Specifications Application method Dispensing Viscosity 75-85 Kcp Process and selection notes Review […]
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About YINCAE TCA 136 YINCAE TCA 136 is a thin-bond-line thermally conductive adhesive for printing and dispensing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Printing Dispensing Specifications Application method Printing; Dispensing Viscosity 20-50 Kcp Process […]
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