Industrial materials · Australia & New Zealand
YINCAE capillary, no-flow and thermal diamond underfill materials for electronics assembly. Discuss flow, cure, viscosity and assembly requirements with ProfTek.
Discuss your application
Current underfill materials range
Technical data and application guidance are available on each material page. Contact ProfTek if you need help comparing options.
About YINCAE UF 158D YINCAE UF 158D is a thermal diamond underfill adhesive for dispensing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Dispensing Specifications Application method Dispensing Viscosity 5-10 Kcp Process and selection notes Review […]
View material →
About YINCAE SMT 158U YINCAE SMT 158U is a capillary and no-flow underfill material for dispensing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Dispensing Specifications Application method Dispensing Viscosity 0.5-0.8 Kcp Process and selection notes […]
View material →
About YINCAE SMT 88U YINCAE SMT 88U is a fast-cure capillary underfill adhesive for dispensing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Dispensing Specifications Application method Dispensing Viscosity 0.3-0.5 Kcp Process and selection notes Review […]
View material →Application-led selection
ProfTek helps technical teams consider the complete process before selecting or replacing a material.
Share the substrate, process, operating conditions and current product. ProfTek will help identify the most practical next step.
