Dedicated Inspection for Mixed-Technology and Power Electronics
Through-hole components continue to be essential in power electronics, automotive ECUs, industrial controls, and high-reliability assemblies. Unlike SMT AOI, THT AOI must verify solder joint quality after wave or selective soldering, where hidden defects such as insufficient fill, solder voids, and component seating errors are not detectable by visual inspection alone. The MEK VeriSpector provides automated, objective inspection at this critical quality gate.
Comprehensive Defect Detection After Wave Soldering
The VeriSpector system detects component absence, incorrect orientation, lead protrusion errors, solder bridges, insufficient solder fill, and open connections across all through-hole solder joints. Its multi-angle imaging and AI-assisted classification reduces false calls while maintaining high defect sensitivity, ensuring reliable boards reach your customers without manual 100% inspection overhead.