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Industrial materials · Australia & New Zealand

Die Attach Adhesives matched to the process

YINCAE die attach adhesives for silicon die, leadframes and PCB assembly, including dispensing and printing processes. Compare cure requirements, viscosity and substrate compatibility with ProfTek.

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Die Attach Adhesives material
Technical selection · Application guidance · ANZ support

Current die attach adhesives range

Available materials

Technical data and application guidance are available on each material page. Contact ProfTek if you need help comparing options.

DA 90UV UV and Thermal-Cure Die Attach Adhesive
Die Attach Adhesives

DA 90UV UV and Thermal-Cure Die Attach Adhesive

About YINCAE DA 90UV YINCAE DA 90UV is a UV and thermal-cure optoelectronic die attach adhesive for dispensing and printing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Dispensing Printing Specifications Application method Dispensing; Printing Viscosity […]

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DA 120F Die Attach Adhesive for Silicon and PCB
Die Attach Adhesives

DA 120F Die Attach Adhesive for Silicon and PCB

About YINCAE DA 120F YINCAE DA 120F is a die attach adhesive for silicon die, leadframes and PCB substrates for dispensing and printing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Dispensing Printing Specifications Application method […]

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DA 90-50 Fast-Cure Die Attach Adhesive
Die Attach Adhesives

DA 90-50 Fast-Cure Die Attach Adhesive

About YINCAE DA 90-50 YINCAE DA 90-50 is a fast-cure thermally conductive die attach adhesive for dispensing and printing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Dispensing Printing Specifications Application method Dispensing; Printing Viscosity 45-60 […]

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DA 90 Low-Temperature Die Attach Adhesive
Die Attach Adhesives

DA 90 Low-Temperature Die Attach Adhesive

DA 90 is a low-temperature, thermally conductive die attach adhesive from YINCAE for dispensing and printing processes. ProfTek represents YINCAE across Australia and New Zealand and can assist with material selection and current technical documentation. View DA 90 product image at full size DA 90 Die Attach Applications Dispensing and Printing DA 90 is intended […]

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Application-led selection

The right material depends on more than product specifications

ProfTek helps technical teams consider the complete process before selecting or replacing a material.

Substrate & compatibilityMatch performance without compromising sensitive materials.
Process equipmentReview equipment, cycle and application requirements.
Operating conditionsConsider temperature, exposure and production constraints.
Safety & complianceAssess handling, documentation and environmental obligations.

Need help selecting or replacing a material?

Share the substrate, process, operating conditions and current product. ProfTek will help identify the most practical next step.

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