YINCAE DA 90 Low-temperature thermally conductive die attach adhesive

DA 90 Low-Temperature Die Attach Adhesive

DA 90 is a low-temperature, thermally conductive die attach adhesive from YINCAE for dispensing and printing processes. ProfTek represents YINCAE across Australia and New Zealand and can assist with material selection and current technical documentation.

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DA 90 Die Attach Applications

Dispensing and Printing

DA 90 is intended for die attach workflows using dispensing or printing. Discuss your substrate, assembly process and operating requirements with ProfTek to confirm suitability.


Material Specifications

Application method Dispensing; Printing
Viscosity 10–25 Kcp

For manufacturer information, visit YINCAE. Ask ProfTek for the current product-specific technical data sheet and safety data sheet before selecting a material.

Process Selection

Review the application method and viscosity range against your process requirements. Contact ProfTek for current technical data sheets, safety data sheets and application guidance.


YINCAE Materials in Australia and New Zealand

ProfTek officially represents YINCAE across Australia and New Zealand. View the YINCAE partner profile for the materials range.

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