Industrial materials · Australia & New Zealand
YINCAE materials for solder joint encapsulation, including CSP, BGA and flip-chip assembly. Compare dispensing, dipping and printable formulations against your assembly process.
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Current solder joint encapsulants range
Technical data and application guidance are available on each material page. Contact ProfTek if you need help comparing options.
About YINCAE SMT 256EP YINCAE SMT 256EP is a printable solder joint encapsulant paste for printing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Printing Specifications Application method Printing Viscosity 80-100 Kcp Process and selection notes […]
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About YINCAE SMT 256ED YINCAE SMT 256ED is a solderable encapsulant for high-temperature lead-free assembly for dispensing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Dispensing Specifications Application method Dispensing Viscosity 30-50 Kcp Process and selection […]
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About YINCAE SMT 256 YINCAE SMT 256 is a solder joint encapsulant for CSP, BGA and flip-chip assemblies for dipping, dispensing and printing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation. View product image at full size Key applications Dipping Dispensing Printing Specifications Application […]
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