YINCAE SMT 256 is a solder joint encapsulant for CSP, BGA and flip-chip assemblies for dipping, dispensing and printing processes. ProfTek represents YINCAE across Australia and New Zealand and can help review your application and current technical documentation.
| Application method | Dipping; Dispensing; Printing |
|---|---|
| Viscosity | 5-20 Kcp |
Review the application method and specification values with ProfTek against your process requirements.
For manufacturer information, visit YINCAE. Ask ProfTek for the current product-specific technical data sheet and safety data sheet before selecting a material.
Technical data sheets and safety data sheets are available on request. Contact ProfTek for current documentation and application guidance.
ProfTek officially represents YINCAE across Australia and New Zealand. View the YINCAE partner profile.
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