The XAVIS XSCAN-H series brings together several X-ray configurations for component inspection. The H110-OCT is a separately specified option for through-glass via (TGV) inspection, with its own imaging and handling specifications.
The H130-OCT uses a closed tube rated at 130 kV and 39 W, with a 5 µm focal spot and a 5-inch flat-panel detector. The H160-OCT uses an open tube rated at 160 kV and 10 W, with a 1 µm focal spot and a 5-inch flat-panel detector.
The H160M also has a 160 kV, 10 W open tube and 1 µm focal spot. Its detector configuration is listed as an image intensifier or flat-panel detector. The family lists seven base axes, with R2 cone-beam CT as an option.
The separately listed H110-OCT has a 520 × 520 mm inspection area and accommodates a 10 kg workpiece. Its source is rated at 110 kV and 16 W with a 2 µm focal spot. Dual oblique and cone-beam CT are standard on this configuration. These CT provisions should not be assumed for the other H-series models.
Provide the sample dimensions, material, area of interest and required viewing angles when discussing an H-series configuration. Confirm the detector and CT requirements for the nominated model before comparing inspection results or planning a sample evaluation.
Identify how samples will be supported and positioned, the features to be reviewed and how operators will use the results. A focal-spot value describes the tube and should not be used alone as a whole-system resolution guarantee. Agree the evaluation criteria using representative samples before selecting a configuration.
Explore the XAVIS equipment range, XSCAN-9800T and 9800T25 PCB X-ray inspection and XSCAN-9860AT semiconductor X-ray inspection.
See official XSCAN-H series information and H110-OCT TGV information. Confirm the current configuration, utilities and installation drawings for the quoted model.
