4 materials
Die Attach Adhesives
YINCAE die attach adhesives for silicon die, leadframes and PCB assembly, including dispensing and printing processes. Compare cure requirements, viscosity and substrate compatibility with ProfTek.
View materials →Industrial materials · Australia & New Zealand
Electronics production materials matched to the process
Materials for electronics assembly, including die attach, underfill, solder joint encapsulation, optoelectronic bonding and thermal interface processes. Contact ProfTek for material selection and technical documentation.
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Technical selection · Application guidance · ANZ support
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Explore electronics production materials categories
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2 materials
Optoelectronic Bonding Materials
YINCAE materials for optoelectronic die attach and fibre-optic bonding, including UV and thermal or dual-cure formulations. Confirm optical assembly, substrate and cure requirements with ProfTek.
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3 materials
Solder Joint Encapsulants
YINCAE materials for solder joint encapsulation, including CSP, BGA and flip-chip assembly. Compare dispensing, dipping and printable formulations against your assembly process.
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3 materials
Thermal Interface Materials
YINCAE materials for thermal interface assembly, including thin-bond-line thermal adhesives, diamond-filled interface adhesives and solderable conductive adhesive. Compare bond-line, dispensing and printing requirements with ProfTek.
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3 materials
Underfill Materials
YINCAE capillary, no-flow and thermal diamond underfill materials for electronics assembly. Discuss flow, cure, viscosity and assembly requirements with ProfTek.
View materials →Current electronics production materials range
Featured materials
Technical data and application guidance are available on each material page. Contact ProfTek if you need help comparing options.
No materials are currently published directly in this category. Explore the categories above or contact ProfTek for assistance.
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The right material depends on more than product specifications
ProfTek helps technical teams consider the complete process before selecting or replacing a material.
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